2017-12-07 07:00 Mobile phone

Ladies and gentlemen, are you currently browsing Weibo with your phone and watching your social media?

So, have you ever felt your phone getting too hot after playing for a long time, complaining about the poor heat dissipation of your phone? I believe the answer from most friends is - yes!

Why is it getting hotter the more you play with your phone?

The editor will give you some science popularization here. Electronic products such as smartphones and tablets mainly rely on internal chips to achieve their rich functions.

With the increasing performance of chips, they generate more and more heat during operation. If these accumulated heat cannot be dissipated in a timely manner, it not only affects the service life of electronic products, but also poses risks such as "explosion".

At the Shenzhen Advanced Technology Research Institute of the Chinese Academy of Sciences, an innovative research team for electronic packaging materials led by Wang Zhengping, an academician of the American Academy of Engineering and a foreign academician of the Chinese Academy of Engineering, and researcher Sun Rong, is researching how to save the "hot" chips.

They started from the internal structure of the chip and targeted the development of new thermal conductive materials to help cool the chip. So, how do these new thermal conductive materials cool down chips?

The process of wrapping chips with special functional materials is called "encapsulation" in industry. “

Packaging not only protects chips from external air and moisture corrosion, but also facilitates their installation and maintenance on printed circuit boards.

These materials that wrap the chips are mostly polymers, because they have excellent mechanical properties and can effectively protect the chips, but their thermal conductivity is very poor.

Relying solely on direct contact between electronic components and heat sinks cannot effectively conduct heat transfer, as there are always many micro grooves or gaps between the surface of the heat source and the heat sink, with 80% of the volume being air - a poor conductor of heat, which seriously affects heat dissipation efficiency.

Therefore, it is particularly important to use high thermal conductivity thermal interface materials to eliminate air in the gaps, increase contact area, and establish a fast thermal conductivity green channel between electronic components and heat sinks, in order to develop high-performance thermal interface materials.

Therefore, scientists have begun to work on packaging materials - developing new heat dissipation materials and applying them to packaging. This is also the research focus of the thermal conductivity team of the Advanced Materials Center.